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202 h k q 0 6 0 3 1 0 _ tjn 1 2 3 4 5 goyordering code ;my applications ??y features 0603 0201 0.60.3 hkq ? *t
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q?b? ~ multilayer inductor made of advanced ceramics with low-resistivity silver used as internal conductors provides excellent q and srf characteristics. ~ designed to address surface mount inductor needs for applications above 100mhz. ~ multilayer block structure ensures outstanding reliability, high productiv- ity and pr oduct quality. ~ portable telephones, phs and w-lan ~ miscellaneous high-frequency circuits ~ emi countermeasur e in high-fr equency circuits. ? *t
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??????? multilayer chip inductor for high frequency hkq series ~ 3?zphsz
lan ~ fww? *ts?z *t
? ?s? ~ ? *t3?pwemi0f 1 4 ? ??????? nh 3 2 hkq multilayer chip inductors for high frequency high q version 1 type 4 nominal inductance n h 3 2 external dimensions mm 0603 0201 0.60.3 3n9 3. 9 10 n 10 3n9 3.9 10n 10 *n10.0 nh type example tn1nhq`ow ?
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5 packaging 5 060355?125? operating temp. inductance tolerances g ? 2 ? h ? 3 ? j ? 5 ? b ? 0 . 1 nh c ? 0 . 2 nh s ? 0 . 3 nh ?????? ?0) g ? 2 ? h ? 3 ? j ? 5 ? b ? 0 . 1 nh c ? 0 . 2 nh s ? 0 . 3 nh
ferrite products 5 203 inductance imax[ma] rdcmax[
] 1 . 5 nh 300 0 . 22 10 . 0 nh 150 0 . 93 100 . 0 nh ? ? ?
goyexternal dimensions hkq type ?
a ?w?7tmv?`oxsemd<^m{ ? please contact our sales department of?ce for products details. type l w t 4 h kq 0603 0 . 6 ? 0 . 03 0 . 3 ? 0 . 03 0 . 3 ? 0 . 03 0 . 09 ? 0 . 04 0201 0 . 024 ? 0 . 001 0 . 012 ? 0 . 001 0 . 012 ? 0 . 001 0 . 0035 ? 0 . 0016 unitmm inch type ?;9s c? 55 ? 125? range inductance y [nh] [nh] 0.6 0.7 0.8 0.9 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10.0 12.0 15.0 18.0 22.0 0n6? 0n7? 0n8? 0n9? 1n0? 1n2? 1n5? 1n8? 2n2? 2n7? 3n3? 3n9? 4n7? 5n6? 6n8 8n2 10n 12n 15n 18n 22n imax [ma] 400 250 250 200 200 170 hkq0603 150 130 110 100 300 ?t??3??y available inductance range ey y? examples t w?ztx???????0)g?u???b{?0.3nh ? z?5? ?q
$ electrical characteristics a packaging ?t
q reliability data ?; w?? precautions etc
204 hkq0603 ??aay part numbers ordering code ?????? inductance nh ?????? ?) tolerance & min } lq *t
: measuring frequency | mhz & typical *t
: frequency | hz ~? *t
: self-resonant frequency | mhz v ? dc.resistance
?v rated current | ma max } ^ thickness | mm inch normal special 500 m 800 m 1 . 8 g 2 . 0 g 2 . 4 g min. typ. max. typ. hkq 0603 y0 n 6 ? 0 . 1 nh step 0 . 6 ? 0 . 3 nh ? 0 . 2 nh z? 0 . 1 nh 13 500 19 26 47 51 57 10000 > 13000 0 . 10 0 . 04 400 0 . 30 ? 0 . 03 0 . 012 ? 0 . 001 hkq 0603 y0 n 7 ? 0 . 7 ? 0 . 3 nh ? 0 . 2 nh z? 0 . 1 nh 13 500 19 26 47 51 57 10000 > 13000 0 . 10 0 . 04 400 hkq 0603 y0 n 8 ? 0 . 8 ? 0 . 3 nh ? 0 . 2 nh z? 0 . 1 nh 13 500 19 26 47 51 57 10000 > 13000 0 . 10 0 . 04 400 hkq 0603 y0 n 9 ? 0 . 9 ? 0 . 3 nh ? 0 . 2 nh z? 0 . 1 nh 13 500 19 26 47 51 57 10000 > 13000 0 . 10 0 . 04 400 hkq 0603 y1 n 0 ? 1 ? 0 . 3 nh ? 0 . 2 nh z? 0 . 1 nh 13 500 19 26 47 51 57 10000 > 13000 0 . 10 0 . 05 400 hkq 0603 y1 n 1 ? 1 . 1 ? 0 . 3 nh ? 0 . 2 nh z? 0 . 1 nh 13 500 19 26 43 46 52 10000 > 13000 0 . 14 0 . 08 300 hkq 0603 y1 n 2 ? 1 . 2 ? 0 . 3 nh ? 0 . 2 nh z? 0 . 1 nh 13 500 18 25 39 42 48 10000 > 13000 0 . 16 0 . 12 300 hkq 0603 y1 n 3 ? 1 . 3 ? 0 . 3 nh ? 0 . 2 nh z? 0 . 1 nh 13 500 18 25 38 40 46 10000 > 13000 0 . 19 0 . 15 300 hkq 0603 y1 n 4 ? 1 . 4 ? 0 . 3 nh ? 0 . 2 nh z? 0 . 1 nh 13 500 18 25 37 39 44 10000 > 13000 0 . 21 0 . 06 300 hkq 0603 y1 n 5 ? 1 . 5 ? 0 . 3 nh ? 0 . 2 nh z? 0 . 1 nh 13 500 17 23 36 38 43 10000 > 13000 0 . 22 0 . 06 300 hkq 0603 y1 n 6 ? 1 . 6 ? 0 . 3 nh ? 0 . 2 nh z? 0 . 1 nh 13 500 17 23 36 38 43 10000 > 13000 0 . 22 0 . 07 300 hkq 0603 y1 n 7 ? 1 . 7 ? 0 . 3 nh ? 0 . 2 nh z? 0 . 1 nh 13 500 17 23 36 38 43 10000 > 13000 0 . 23 0 . 09 300 hkq 0603 y1 n 8 ? 1 . 8 ? 0 . 3 nh ? 0 . 2 nh z? 0 . 1 nh 13 500 17 23 36 38 43 9500 > 13000 0 . 23 0 . 10 300 hkq 0603 y1 n 9 ? 1 . 9 ? 0 . 3 nh ? 0 . 2 nh z? 0 . 1 nh 13 500 17 23 35 37 42 9500 13000 0 . 24 0 . 12 300 hkq 0603 y2 n 0 ? 2 ? 0 . 3 nh ? 0 . 2 nh z? 0 . 1 nh 13 500 17 23 35 37 42 9500 13000 0 . 24 0 . 14 300 hkq 0603 y2 n 2 ? e 24 step 2 . 2 ? 0 . 3 nh ? 0 . 2 nh 13 500 17 22 35 37 42 9000 13000 0 . 26 0 . 20 300 hkq 0603 y2 n 4 ? 2 . 4 ? 0 . 3 nh ? 0 . 2 nh 13 500 17 22 34 36 40 8800 12000 0 . 26 0 . 12 250 hkq 0603 y2 n 7 ? 2 . 7 ? 0 . 3 nh ? 0 . 2 nh 13 500 16 22 33 35 38 7700 11000 0 . 27 0 . 13 250 hk & 0603 y3 n 0 ? 3 ? 0 . 3 nh ? 0 . 2 nh 13 500 16 22 32 34 38 7300 10000 0 . 28 0 . 18 250 hk & 0603 y3 n 3 ? 3 . 3 ? 0 . 3 nh ? 0 . 2 nh 13 500 16 22 32 34 38 7000 10000 0 . 29 0 . 22 250 hk & 0603 y3 n 6 ? 3 . 6 ? 0 . 3 nh ? 0 . 2 nh 13 500 16 22 32 34 38 7000 10000 0 . 36 0 . 26 200 hk & 0603 y3 n 9 ? 3 . 9 ? 0 . 3 nh ? 0 . 2 nh 13 500 16 22 32 34 38 7000 10000 0 . 42 0 . 29 200 hk & 0603 y4 n 3 ? 4 . 3 ? 0 . 3 nh ? 0 . 2 nh 13 500 16 22 32 34 37 6200 9000 0 . 46 0 . 30 200 hk & 0603 y4 n 7 ? 4 . 7 ? 0 . 3 nh ? 0 . 2 nh 13 500 16 21 32 34 36 5500 8000 0 . 46 0 . 31 200 hk & 0603 y5 n 1 ? 5 . 1 ? 0 . 3 nh ? 0 . 2 nh 13 500 16 21 32 34 36 5500 8000 0 . 46 0 . 32 200 hkq 0603 y5 n 6 ? 5 . 6 ? 0 . 3 nh ? 0 . 2 nh 13 500 16 21 32 34 36 5500 8000 0 . 55 0 . 42 170 hkq 0603 y6 n 2 ? 6 . 2 ? 0 . 3 nh ? 0 . 2 nh 13 500 16 21 31 33 35 5500 8000 0 . 72 0 . 45 170 hkq 0603 y6 n 8 6 . 8 ? 5 % ? 3 % 13 500 16 21 31 33 35 5000 7500 0 . 74 0 . 48 150 hkq 0603 y7 n 5 7 . 5 ? 5 % ? 3 % 13 500 16 21 30 32 33 5000 7500 0 . 74 0 . 30 150 hkq 0603 y8 n 2 8 . 2 ? 5 % ? 3 % 13 500 16 21 30 31 32 4500 6500 0 . 74 0 . 40 150 hkq 0603 y9 n 1 9 . 1 ? 5 % ? 3 % 13 500 16 21 29 30 31 4500 6500 0 . 93 0 . 48 150 hkq 0603 y 10 n e 12 step 10 ? 5 % ? 3 %, ? 2 % 13 500 16 21 28 29 31 4000 6000 0 . 93 0 . 52 150 hkq 0603 y 12 n 12 ? 5 % ? 3 %, ? 2 % 12 500 15 19 25 26 25 3500 5300 0 . 93 0 . 52 150 hkq 0603 y 15 n 15 ? 5 % ? 3 %, ? 2 % 12 500 15 18 22 21 20 2500 4600 1 . 04 0 . 65 130 hkq 0603 y 18 n 18 ? 5 % ? 3 %, ? 2 % 11 500 14 17 20 20 17 2300 3800 1 . 17 0 . 73 110 hkq 0603 y 22 n 22 ? 5 % ? 3 %, ? 2 % 10 500 14 17 18 17 13 2000 3400 1 . 28 0 . 80 100 t w?ztx???????0)g?u???b{?0.3nh ? z?5? ? ferrite products 5 205 ?
q
$yelectrical characteristics q- *t
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q?y q-characteristics measured by hp8719c ??e??? *t
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q?y impedance-vs-frequency characteristics measur ed by hp8719 c ?? ???? *t
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q?y inductane-vs-frequency characteristics measur ed by hp8719 c hkq0603
10 2 10 4 10 0 0.01 0.1 1 10 impedance 10nh 2.2nh hkq0603 q 50 45 40 35 30 25 20 15 10 5 0 0.01 0.1 1 10 10nh 2.2nh hkq0603 50 40 30 20 10 0.01 0.1 1 10 10nh 2.2nh
ay packaging 238 ?a?e??py taping material ?7 ? !?o?
: minimum quantity a?e??ay tape & reel packaging yy type
a ?? thickness | mm inch a j
:? |pcs standard quantity a? paper tape ??a? embossed tape ck 1608 0603 0 . 8 4000 ? 0 . 031 ck 21 25 0805 0 . 85 4000 ? 0 . 033 1 . 25 ? 20 00 0 . 04 9 ckp 2520 1008 0 . 85 ? 3000 0 . 03 3 lk 1005 0402 0 . 5 10000 ? 0 . 020 lk 16 08 0603 0 . 8 4000 ? 0 . 031 lk 21 25 0805 0 . 85 4000 ? 0 . 033 1 . 25 ? 20 00 0 . 04 9 hk 0603 0201 0 . 3 15000 ? 0 . 012 hk 10 05 0402 0 . 5 10000 ? 0 . 020 hk 16 08 0603 0 . 8 4000 ? 0 . 031 hk 21 25 0805 0 . 85 ? 4000 0 . 03 3 1 . 0 ? 3000 0 . 03 9 hkq 0603 0201 0 . 3 15000 ? 0 . 012 aq 10 5 0402 0 . 5 10000 ? 0 . 020 bk 06 03 0201 0 . 3 15000 ? 0 . 012 bk 10 05 0402 0 . 5 10000 ? 0 . 020 bk 16 08 0603 0 . 8 4000 ? 0 . 031 bk 21 25 0805 0 . 85 4000 ? 0 . 033 1 . 25 ? 20 00 0 . 04 9 bk 2010 0804 0 . 45 4000 ? 0 . 018 bk 32 16 1206 0 . 8 ? 4000 0 . 03 1 bkp 1005 0402 0 . 5 10000 ? 0 . 020 bkp 1 608 0603 0 . 8 4000 ? 0 . 031 bkp 2 125 0805 0 . 85 4000 ? 0 . 033 c k 1 6 0 8 c k 2 1 2 5 l k 1 0 0 5 l k 1 6 0 8 l k 2 1 2 5 h k 0 6 0 3 h k 1 0 0 5 h k 1 6 0 8 h k q 0 6 0 3 a q 1 0 5 b k 0 6 0 3 b k 1 0 0 5 b k 1 6 0 8 b k 2 1 2 5 b k 2 0 1 0 b k p 1 0 0 5 b k p 1 6 0 8 b k p 2 1 2 5 2 1 2 5 2 5 2 0 2 1 2 5 2 1 2 5 2 1 2 5 3 2 1 6 c k c k p l k h k b k b k
ay packaging ferrite products 5 239 ck2125 0805 1.25 1.5?0.2 2.3?0.2 4.0?0.1 2.0 0.3 0.049 0.059?0.008 0.091?0.008 0.157?0.004 0.079 0.012 ckp 2520 1008 0.85 2.15?0.1 2.7?0.1 4.0?0.1 1.5 0.3 0.033 0.085?0.004 0.107?0.004 0.157?0.004 0.059 0.012 lk 2125 0805 1.25 1.5?0.2 2.3?0.2 4.0?0.1 2.0 0.3 0.049 0.059?0.008 0.091?0.008 0.157?0.004 0.079 0.012 0.85 1.5 hk 2125 0805 0.033 1 .5?0 . 2 2.3?0.2 4.0?0.1 0.059 0.3 1.0 0.059?0.008 0.091?0.008 0.157?0.004 2.0 0.012 0.039 0.079 bk 2125 0805 1.25 1.5?0. 2 2.3?0.2 4.0?0.1 2.0 0.3 0. 049 0.059?0.008 0.091?0.008 0.157?0.004 0.079 0.012 bk 3216 1206 0.8 1.9?0.1 3.5?0.1 4.0?0.1 1.4 0.3 0.031 0.075?0.004 0.138?0.004 0.157?0.004 0.055 0.012
a ?? ??
? ?
?e?? a?? thickness chip cavity insertion pitch tape thickness mm a b f t ck1608 0603 0.8 1.0?0.2 1.8?0.2 4.0?0.1 1.1max 0.031 0.039?0.008 0.071?0.008 0.157?0.004 0.043max ck2125 0805 0.85 1.5?0.2 2.3?0.2 4.0?0.1 1.1max 0.033 0.059?0.008 0.091?0.008 0.157?0.004 0.043max lk1005 0402 0.5 0.65?0.1 1.15?0.1 2.0?0.05 0.8max 0.020 0.026?0.004 0.045?0.004 0.079?0.002 0.031max lk1608 0603 0.8 1.0?0.2 1.8?0.2 4.0?0.1 1.1max 0.031 0.039?0.008 0.071?0.008 0.157?0.004 0.043max lk2125 0805 0.85 1.5?0.2 2.3?0.2 4.0?0.1 1.1max 0.033 0.059?0.008 0.091?0.008 0.157?0.004 0.043max hk0603 0201 0.3 0.40?0.06 0.70?0.06 2.0?0.05 0.45max 0.012 0.016?0.002 0.028?0.002 0.079?0.002 0.018max hk1005 0402 0.5 0.65?0.1 1.15?0.1 2.0?0.05 0.8max 0.020 0.026?0.004 0.045?0.004 0.079?0.002 0.031max hk1608 0603 0.8 1.0?0.2 1.8?0.2 4.0?0.1 1.1max 0.031 0.039?0.008 0.071?0.008 0.157?0.004 0.043max hkq0603 0201 0.3 0.40?0.06 0.70?0.06 2.0?0.05 0.45max 0.012 0.016?0.002 0.028?0.002 0.079?0.002 0.018max aq105 0402 0.5 0.75?0.1 1.15?0.1 2.0?0.05 0.8max 0.020 0.030?0.004 0.045?0.004 0.079?0.002 0.031max bk0603 0201 0.3 0.40?0.06 0.70?0.06 2.0?0.05 0.45max 0.012 0.016?0.002 0.028?0.002 0.079?0.002 0.018max bk1005 0402 0.5 0.65?0.1 1.15?0.1 2.0?0.05 0.8max 0.020 0.026?0.004 0.045?0.004 0.079?0.002 0.031max bk1608 0603 0.8 1.0?0.2 1.8?0.2 4.0?0.1 1.1max 0.031 0.039?0.008 0.071?0.008 0.157?0.004 0.043max bk2125 0805 0.85 1.5?0.2 2.3?0.2 4.0?0.1 1.1max 0.033 0.059?0.008 0.091?0.008 0.157?0.004 0.043max bk2010 0804 0.45 1.2?0.1 2.17?0.1 4.0?0.1 0.80max 0.018 0.047?0.004 0.085?0.004 0.157?0.004 0.031max bkp1005 0402 0.5 0.65?0.1 1.15?0.1 2.0?0.05 0.8max 0.020 0.026?0.004 0.045?0.004 0.079?0.002 0.031max bkp1608 0603 0.8 1.0?0.2 1.8?0.2 4.0?0.1 1.1max 0.031 0.039?0.008 0.071?0.008 0.157?0.004 0.043max bkp2125 0805 0.85 1.5?0.2 2.3?0.2 4.0?0.1 1.1max 0.033 0.059?0.008 0.091?0.008 0.157?0.004 0.043max ~ a? 8mm ? ????? ? ~ ? leader and blank portion ????
go reel size ?a?e??
goy taping dimensions paper tape 0.315 inches wide 2.0 ? 0.5 0.079 ? 0.031 13.0 ? 0.2 0.512 ? 0.020 ???a?sy top tape strength ??a?w #m?xz<
$1m2to0.1?0.7nqs??b{ the top tape requires a peel-off force of 0.1?0.7 n in the direction of the arrow as illustrated below. unit : mm inch unit : mm inch 160mm? 6.3inches or more ?v z`m2 direction of tape feed 100mm? 3.94inches or more 400mm? 15.7inches or more a??max. tape thickness k t
?e?? insertion pitch f yy type ??
? ? chip cavity a b
a ?? thickness mm ~??a?8mm ? embossed tape 0.312 inches wide yy type
ferrite products 5 241 reliability data 1/4 multilayer chip inductors and beads * de?nition of rated current : in the ck and bk series, the rated current is the value of current at which the temperature of the element is increased within 20? . in the bk series p type and ck series p type, the rated current is the value of current at which the temperature of the element is increased within 40? . in the lk,hk,hkq,and aq series, the rated current is either the dc value at which the internal l value is decreased within 5 % with the application of dc bias, or the value of current at which the temperature of the element is increased within 20? . 5.inductance bkp1608 bkp1005 lk1608 bk2125 bk3216 bk1005 bk0603 bk1608 100 ? 500ma dc 10 ? 600
? 25 ? 150 ? 1000ma dc 10 ? 1000
? 25 ? 150 ? 1500ma dc 22 ? 2500
? 25 ? 200 ? 1200ma dc 15 ? 2500
? 25 ? 100ma dc 5 ? 600
? 25 ? 100 ? 200ma dc 68 ? 1000
? 25 ? 1.0a dc 120
? 25 ? 1.0 ? 3.0a dc 33 ? 390
? 25 ? 2.0 ? 4.0a dc 60 ? 500ma dc 0.1 ? 10.0 h ? 20 ? 1.0 ? 4.7 h ? 20 ? 0.12 ? 2.2 h ? 10 ? 0.047 ? 33.0 h ? 20 ? 0.10 ? 12.0 h ? 10 ? 0.047 ? 33.0 h ? 20 ? 0.10 ? 12.0 h ? 10 ? 1.0 ? 6.2nh ? 0.3nh 6.8 ? 100nh ? 5 ? 1.0 ? 6.2nh ? 0.3nh 6.8 ? 270nh ? 5 ? 1.0 ? 5.6nh ? 0.3nh 6.8 ? 470nh ? 5 ? 1.0 ? 5.6nh ? 0.3nh 6.8 ? 470nh ? 5 ? 10 ? 25ma dc 1 ? 50ma dc 5 ? 300ma dc 40 ? 250ma dc 110 ? 300ma dc 150 ? 300ma dc 300ma dc 33 ? 220
? 25 ? ?? 55 ? 125 ? 55 ? 125 ? bk2010 hk2125 hk1608 55 ? 85 ? 55 ? 85 ? ck2125 lk1005 hk0603 hk1005 40 ? 85 ? 40 ? 85 ? 40 ? 85 ? 40 ? 8 5 ? 55 ? 1 25 ? 55 ? 125 ? bkp2125 lk2125 ?? ?? ?? ?? ?? ?? 50 ? 60ma dc 4.7 ? 10.0 h ? 20 ? ck1608 ?? ?? ?? ?? ?? item 1.operating te m p e r a t u re range 2.sto r age tem- p erature range 3.rated current 4.impedance specified value array test methods and remarks bk0603 series: measuring frequency: 100 ? 1mhz measuring equipment: hp4291a measuring jig: 16193a bk1005 series: bkp1005 series: measuring frequency: 100 ? 1mhz measuring equipment: hp4291a measuring jig: 16192a, 16193a bk1608, 2125 series: bkp1608, 2125 series: measuring frequency: 100 ? 1mhz measuring equipment: hp4291a, hp4195a measuring jig: 16092a or 16192a hw bk2010, 3216 series: measuring frequency: 100 ? 1mhz measuring equipment: hp4291a, hp4195a measuring jig: 16192a ck series: measuring frequency: 2 to 4mhz ck1608 measuring frequency: 2 to 25mhz ck2125 measuring frequency: 1mhz ckp2520 lk series: measuring frequency: 10 to 25mhz lk1005 measuring frequency: 1 to 50mhz lk1608 measuring frequency: 0.4 to 50mhz lk2125 measuring equipment, jig: hp4194 16085b 16092a or its equivalent hp4195 41951 16092a or its equivalent hp4294 16192a hp4291a 16193a lk1005 hp4285a 42841a 42842c 42851-61100 ckp2520 measuring current: 1ma rms 0.047 to 4.7 h 0.1ma rms 5.6 to 33 h hk ~ hkq ~ aq series: measuring frequency: 100mhz hk0603, hk1005,aq105 measuring frequency: 50/100mhz hk1608, hk2125 measuring frequency: 500mhz hkq0603 measuring equipment, jig: hp4291a 16197a hk0603 ~ aq105 hp4291a 16193a hk1005 e4991a 16197a hkq0603 hp4291a or its equivalent 16092a in-house made jig hk1608, 2125 ckp2520 1.1 ? 1.4a dc 200 ? 510ma dc 55 ? 125 ? 55 ? 125 ? 1.0 ? 6.2nh ? 0.3nh 6.8 ? 15nh ? 5 ? aq105 ?? ?? 100 ? 400ma dc 55 ? 125 ? 55 ? 125 ? 0.6 ? 6.2nh ? 0.3nh 6.8 ? 22nh ? 5 ? hkq0603
ferrite products 5 243 reliability data 2/4 multilayer chip inductors and beads bkp1608 bkp1005 lk1608 bk2125 bk3216 bk1005 bk0603 bk1608 bk2010 aq105 hk1608 ck2125 lk1005 hk0603 hk1005 bkp2125 lk2125 10 ? 20 min. 15 ? 2 0 min. 10 ? 3 5 min. 15 ? 5 0 min. 4 ? 5 mi n. 8 ? 12 mi n. 8min. 8 min. ?? 0.05 ? 0.80
max. 0.075 ? 1.50
max. 0.05 ? 1.10
max. 0.05 ? 0.75
max. 0.10 ? 0.90
max. 0.15 ? 0.80
max. 0.025 ? 0.140
max. 0.140
max. 0.020 ? 0.050
max. 0.16 ? 0.65
max. 24 ? 235mhz min. 40 ? 180mhz min. 9 ? 260mhz min. 13 ? 320mhz min. 900 ? 10000mhz min. 400 ? 10000mhz min. 300 ? 10000mhz min. 2300 ? 10000mhz min. ?? ?? ?? ckp2520 ?? 0.08 ? 0.15
max. ? ? 0.7 ? 1.70
max. 0.3 ? 2.95
max. 0.20 ? 1.25
max. 0.14 ? 4.0
max. ck1608 20 min. 0.45 ? 0.85
? 30 ? 17 ? 25mhz min. 0.08 ? 4.8
max. 0.07 ? 0.45
max. hk2125 10 ? 18 min. hkq0603 10 ? 13 min. 200 ? 4000mhz min. 2000 ? 10000mhz min. 0.10 ? 1.5
max. 0.10 ? 1.28
max. 0.05 ? 2.6
max. 6.q specified value item array test methods and remarks inductance change: wi thin ? 1 0% 7.dc resistance 8. self resonance frequency srf 9.temperature characteristic 10. resistance to flexure of substrate no mechanical damage. lk series: measuring frequency: 10 to 25 mhz lk1005 ck series: measuring frequency: 2 to 4 mhz ck1608 measuring frequency: 2 to 25 mhz ck2125 measuring fr equency: 1 to 50 mhz lk1608 measuring frequency: 0.4 to 50mhz lk2125 measuring equipment, jig: hp4194a 16085b 16092a hp4195a 41951 16092a hp4294a 16192a hp4291a 16193a lk1005 or its equivalent or its equivalent measuring current: 1ma rms 0.047 to 4.7 h 0.1ma rms 5.6 to 33 h measuring frequency: 100mhz hk0603, hk1005,aq105 hp4291a 16193a hk1005 hp4291a 16197a hk0603,aq105 measuring equipment: voac ? 7412 made by iwasaki tsushinki voac ? 7512 made by iwasaki tsushinki lk series: measuring equipment: hp4195a measuring jig: 41951 16092a or its equivalent hk, hkq, aq series: measuring equipment: hp8719c ~ hp8753d hk2125 hk, hkq, aq series: t emperature range: 30 to 85 ? refer ence temperature: 20 ? warp: 2mm testing board: glass epoxy-r esin substrate thickness: 0.8mm hp4195a 16092a in-house made jig hk1608, 2125 measuring frequency: measur ing frequency: 50 / 100mhz hk1608 , 2125 measur ing frequency: 500mhz hkq0603 hk, hkq, aq series: e4991a 16197a hkq0603
ferrite products 5 245 reliability data 3/4 (note 1 ) when there are questions concerning mesurement result ? measurement shall be made after 48 ? 2 hrs of recovery under the standard condition. multilayer chip inductors and beads bkp1608 bkp1005 ckp2520 lk1608 bk2125 bk3216 bk1005 bk0603 bk1608 bk2010 hk2125 hkq0603 aq105 hk1608 ck2125 ck1608 lk1005 hk0603 hk1005 bkp2125 lk2125 specified value item test methods and remarks no mechanical damage. remaining terminal electrode: 70% min. inductance change r10 ? 4r7: within ? 10% 6r8 ? 100: within ? 15% ckp2520: within ? 30% no mechanical damage. remaining terminal electrode: 70% min. inductance change 47n ? 4r7: within ? 10% 5r6 ? 330: within ? 15% no mechanical damage. remaining terminal electrode: 70% min. inductance change: within ? 15% no mechanical damage. remaining terminal electrode: 70% min. inductance change: within ? 5% no mechanical damage. inductance change: within ? 10% qchange: within ? 30% no mechanical damage. inductance change: within ? 10% qchange: within ? 20% a t le a st 75% of terminal electrode is covered by new solder. appearance: no significant abnormality impeda nce change: within ? 30% appearance: no significant abnormality i m p eda nce change: within ? 30% 11.solderability 1 2.re s istance to soldering 13.thermal shock solder temperature: 230 ? 5 ? duration: 4 ? 1 sec. solder temperature: 260 ? 5 ? duration: 10 ? 0.5 sec. preheating temperature: 150 to 180 ? preheating time: 3 min. recovery: 2 to 3 hrs of recovery under the stan- dard condition after the test. see note 1 flux: immersion into methanol solution with colophony for 3 to 5 sec. conditions for 1 cycle step 1: minimum operating temperature 0/ ? 3 ? 30 ? 3 min. step 2: room temperature 2 to 3min. step 3: minimum operating temperature 0/ ? 3 ? 30 ? 3 min. step 4: room temperature 2 to 3min. number of cycles: 5 recovery: 2 to 3 hrs of recovery under the stan- dard condition after the test. see note 1 no mechanical damage. inductance change: within ? 20% qchange: within ? 30% no mechanical damage. inductance change: within ? 30% array at least 75% of terminal electrode is covered by new solder.
ferrite products 5 247 reliability data 4/4 multilayer chip inductors and beads note on standard condition: "standard condition" referred to herein is de?ned as follows: 5 to 35? of temperature, 45 to 85 % relative humidity, and 86 to 106 kpa of air pressure. when there are questions concerning measurement results: in order to provide correlation data, the test shall be conducted under condition of 20 ? 2? of temperature, 60 to 70 % relative hu- midity, and 86 to 106kpa of air pr essure. unless otherwise speci?ed, all the tests are conducted under the "standard condition." (note 1) measurement shall be made after 48 ? 2 hrs of recovery under the standard condition. bkp1608 bkp1005 ckp2520 lk1608 bk2125 bk3216 bk1005 bk0603 bk1608 bk2010 hk2125 hkq0603 aq105 hk1608 ck2125 ck1608 lk1005 hk0603 hk1005 bkp2125 lk2125 specified value item test methods and remarks array 14. damp heat fsteady stateg 15.loading under damp heat 16.loading at high temperatur e bk series: temperature: 40 ? 2 ? humidity: 90 to 95%rh duration: 500 hrs recovery: 2 to 3 hrs of recovery under the standard condition after the removal from t est chamber. see note1 see note1 see note1 lk, ck, ckp, hk, hkq, aq series: temperature: 40 ? 2 ? lk, ck series 60 ? 2 ? hk , hkq, aq series humidity: 90 to 95%rh duration: 500 ? 12 hours recovery: 2 to 3 hrs of recovery under the standard condition after the removal from t est chamber. standard condition after the removal f rom t est chamber. bk series: temperature: 40 ? 2 ? lk series humidity: 90 to 95%rh duration: 500 hrs applied current: rated current recove ry: 2 to to 3 hrs of recovery under the see note1 from test chamber. 2 to 3 hrs of recovery under the see note1 standard condition after the removal from t est chamber. 3 hrs of recovery under the lk, ck, ckp, hk, hkq, aq series: temperature: 40 ? 2 ? lk, ck series 60 ? 2 ? hk , hkq, aq series humidity: 90 to 95%rh duration: 500 ? 12 hrs applied current: rated current recov e ry: 2 bk series: temperature: 125 ? 3 ? applied current: rated current duration: 500 hrs recovery: lk, ck, ckp, hk, hkq, aq series, bk series p type: t emperature: 85 ? 2? lk, ck, ckp series : 85 ? 3 ? bk series p type : 85 ? 2? hk 1608, 2125 : 85 ? 2? hk 1005 aq105 operating temperature range ? 55 to 85 ? : 125 ? 2? hk 0603, hk1005, hkq0603, aq105 operating temperature range ? 55 to 125 ? applied current: rated current duration: 500 ? 12 hrs recovery: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. +24 ? 0 appearance: no significant abnormality impedance change: within ? 30% appearance: no significant abnormality i m peda nce change: within ? 30% no mechanical damage, inductance change within ? 30 ? +24 ? 0 +24 ? 0 no mechanica damage. inductance change: within ? 20% q chan ge: within ? 30% no mechanica damage. inductance change: within ? 10% q chan ge: within ? 30% no mechanica damage. inductance change: within ? 10% q chan ge: within ? 20% no mechanica damage. inductance change: within ? 10% q chan ge: within ? 30% no mech anica damage. induct ance change: within ? 30% no mechanica damage. inductance change: within ? 20% q cha n ge: within ? 30% no mechanica damage. inductance change: within ? 10% q cha n ge: within ? 30% no mecha nica damage. inductance change: 0.047 to 12.0 h: within ? 10% 15.0 to 33.0 h: within ? 15% q cha n ge: within ? 30% no mecha nica damage. inductance change: within ? 10% q chan ge: within ? 30% no mechanica damage. inductance change: within ? 10% q cha n ge: within ? 20% no mechanica damage. induc t ance change: within ? 30% no mechanica damage. inductance change: within ? 20% q cha n ge: within ? 30% no mechanica damage. inductance change: within ? 10% q cha n ge: within ? 30% no mecha nica damage. inductance change: 0.047 to 12.0 h: within ? 10% 15.0 to 33.0 h: within ? 15% q chan ge: within ? 30% no mecha nica damage. inductance change: within ? 10% q chan ge: within ? 30% no mechanica damage. inductance change: within ? 10% q cha n ge: within ? 20% no mechanica damage. induc t ance change: within ? 30% see note1 standard condition after the removal
precautions ferrite products 5 249 type 1608 2125 3216 l 1.6 2.0 3.2 w 0.8 1.25 1.6 a 0.8?1.0 1.0?1.4 1.8?2.5 b 0.5?0.8 0.8?1.5 0.8?1.7 c 0.6?0.8 0.9?1.2 1.2?1.6 1/7 precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip beads 1 . circuit design veri?cation of operating environment, electrical rating and performance 1 . a m a lfunction in medical equipment, spacecraft, nucle- ar r eactors, etc. may cause serious harm to human life or have sever e social rami?cations. as such, any inductors to be used in such equipment may r equir e higher safety and/or r eliability considerations and should be clearly dif ferentiated from components used in general purpose applications. operating current veri?cation of rated current 1 . the operating current for inductors must always be lower than their rated values. 2 . do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect. technical considerations stages precautions 2. pcb design pattern con?gurations design of land-patterns 1 . when inductors are mounted on a pcb, the size of land patterns and the amount of solder used size of fillet can directly affect inductor performance. therefore, the following items must be carefully con- sider ed in the design of solder land patter ns: 1 the amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. therefore, when designing land-patterns it is necessary to consider the appropriate size and con?guration of the solder pads which in turn determines the amount of solder necessary to form the ?llets. 2 when more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated by solder-resist. 3 the larger size of land patterns and amount of solder, the smaller q value after mounting on pcb. it makes higher the q value to design land patterns smaller than terminal electrode of chips. 1 . the following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts larger ?llets which extend above the component end terminations . examples of improper pattern designs are also shown. 1 recommended land dimensions for a typical chip inductor land patterns for pcbs recommended land dimensions for re?ow-soldering unit: mm size excess solder can affect the ability of chips to withstand mechanical stresses. therefore, please take proper precautions when designing land-patterns. recommended land dimensions for wave-soldering unit: mm recommended land dimension for re?ow-soldering unit: mm 3216 2010 l 3.2 2.0 w 1.6 1.0 a 0.7 ? 0.9 0.5 ? 0.6 b 0.8 ? 1.0 0.5 ? 0.6 c 0.4 ? 0.5 0.2 ? 0.3 d 0.8 0.5 size size type 0603 1005 105 1608 2125 3216 2520 l 0.6 1.0 1.0 1.6 2.0 3.2 2.5 w 0.3 0.5 0.6 0.8 1.25 1.6 2.0 a 0.20?0.30 0.45?0.55 0.50?0.55 0.6?0.8 0.8?1.2 1.8?2.5 1.0?1.4 b 0.20?0.30 0.40?0.50 0.30?0.40 0.6?0.8 0.8?1.2 0.6?1.5 0.6?1.0 c 0.25?0.40 0.45?0.55 0.60?0.70 0.6?0.8 0.9?1.6 1.2?2.0 1.8?2.2
precautions ferrite products 5 251 2 examples of good and bad solder application not recommended recommended 2.pcb design not recommended recommended de?ection of the board mixed mount- ing of smd and lea ded compo- nents c o m p o n e n t placement close to the chassis h and-s oldering o f l e a d e d c o m p o n e n t s near mounted components horizontal com- ponent place- ment pattern con?gurations inductor layout on panelized | breakaway pc boards 1 . after inductors have been mounted on the boards, chips can be subjected to mechanical stresses in sub- s eque n t manufacturing processes pcb cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the re?ow soldered boards etc. for this reason, planning pattern con?gurations and the position of smd inductors should be carefully performed to minimize stress. 1-1 . the following are examples of good and bad inductor layout; smd induc- tors should be located to minimize any possible mechanical stresses from board warp or de?ection. item 1-2 . to layout the inductors for the breakaway pc board, it should be noted that the amount of mechanical stresses given will vary depending on in- ductor layout. an example below should be counted for better design. 1-3 . when breaking pc boards along their perforations, the amount of me- chanical stress on the inductors can vary according to the method used. the following methods are listed in order from least stressful to most stressful: push-back, slit, v-grooving, and perforation. thus, any ideal smd inductor layout must also consider the pcb splitting procedure. 2/7 stages precautions technical considerations precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip beads
precautions ferrite products 5 253 3 / 7 technical considerations stages precautions 1 . if the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. to avoid this, the following points should be considered before lowering the pick-up nozzle: 1 the lower limit of the pick-up nozzle should be adjusted to the surface level of the pc board after correcting for de?ection of the board. 2 the pick-up pressure should be adjusted between 1 and 3 n static loads. 3 to reduce the amount of de?ection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the pc board. the following diagrams show some typical examples of good pick-up nozzle placement: improper method proper method 2 . as the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical im- p a c t o n the inductors. to avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically. selec t ion of adhesives 1 . mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use. 1 . some adhesives may cause reduced insulation resistance. the differ- e nce be tween the shrinkage percentage of the adhesive and that of the inductors may result in stresses on the inductors and lead to cracking. moreover, too little or too much adhesive applied to the board may ad- v e r s e l y affect component placement, so the following precautions should be noted in the application of adhesives. 1 required adhesive characteristics a. the adhesive should be strong enough to hold parts on the board during the mounting & solder process. b. the adhesive should have suf?cient strength at high temperatures. c. the adhesive should have good coating and thickness consistency. d. the adhesive should be used during its prescribed shelf life. e. the adhesive should harden rapidly f. the adhesive must not be contaminated. g. the adhesive should have excellent insulation characteristics. h. the adhesive should not be toxic and have no emission of toxic gasses. 3 .considerations for automatic placement adjustment of mounting machine 1 . excessive impact load should not be imposed on the inductors when mounting onto the pc boards. 2 . the maintenance and inspection of the mounter should be conducted periodically. double-sided mounting single-sided mounting precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip beads
precautions ferrite products 5 255 3 .considerations for automa tic placement 4 .soldering selection of flux 1 . since ?ux may have a signi?cant effect on the perfor- mance of inductors, it is necessary to verify the follow- i n g c o nditions prior to use; 1 flux used should be with less than or equal to 0 . 1 wt% chlorine conversion method of halogenated content. flux having a strong acidity content should not be applied. 2 when soldering inductors on the board, the amount of flux applied should be controlled at the optimum level. 3 when using water-soluble ?ux, special care should be taken to properly clean the boards. soldering temperature, time, amount of solder, etc. are speci?ed in accordance with the following recommended conditions. 1 - 1 . when too much halogenated substance chlorine, etc. content is used to activate the ?ux, or highly acidic ?ux is used, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the inductor. 1 - 2 . flux is used to increase solderability in ?ow soldering, but if too much is applied, a large amount of ?ux gas may be emitted and may detrimentally affect solderability. to minimize the amount of ?ux applied, it is recom- m ended to use a ?ux-bubbling system. 1 - 3 . since the residue of water-soluble ?ux is easily dissolved by water content in the air, the residue on the surface of inductor in high humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. the cleaning methods and the capability of the machines used should also be considered carefully when selecting water- soluble ?ux. 1 - 1 . preheating when soldering heating: chip inductor components should be preheated to within 100 to 130 ? of the soldering. cooling: the temperature difference between the components and cleaning process should not be greater than 100 ? . chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. therefore, the soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock. technical considerations stages precaution 4 / 7 figure 0805 case sizes as examples a 0 . 3 mm min b 100 ? 120 m c area with no adhesive when using adhesives to mount inductors on a pcb, inappropriate amounts of adhesive on the board may adversely affect component placement. too little adhesive may cause the inductors to fall off the board during the solder process. too much adhesive may cause defective soldering due excessive ?ow of adhe- s i v e o n to the land or solder pad. | recommended conditions precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip beads
precautions ferrite products 5 257 5 / 7 stages precautions technical considerations 4 .soldering recommended conditions for soldering | re?ow soldering temperature pro?le 2 . because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible. | wave soldering temperature pro?le caution 1 . the ideal condition is to have solder mass ?llet controlled to 1 / 2 to 1 / 3 of the thickness of the inductor, as shown below: caution 1 . make sure the inductors are preheated suf?ciently. 2 . the temperature difference between the inductor and melted solder should not be greater than 100 to 130 ? 3 . cooling after soldering should be as gradual as possible. 4 . wave soldering must not be applied to the inductors designated as for re- ? ow s o ldering only. | hand soldering temperature pro?le caution 1 . use a 20 w soldering iron with a maximum tip diameter of 1 . 0 mm. 2 . the soldering iron should not directly touch the inductor. cleaning conditions 1 . when cleaning the pc board after the inductors are all mounted, select the appropriate cleaning solu- t ion a c cording to the type of flux used and pur- pose o f the cleaning e.g. to remove soldering ?ux or other materials from the production process. 1 . the use of inappropriate solutions can cause foreign substances such as ?ux residue to adhere to the inductor, resulting in a degradation of the inductor's electrical properties especially insulation resistance . 5 .cleaning precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip beads and please contact us about peak temperature when you use lead-free paste. e?? 260 ??< 10 | e?? 260 ??< 10 | '? 150? 60 ? 350 ??< 3 | 120 ? 60 ? '?150? ?c?230 ?? 40 | t?? qx?i9sqw)u 100 ? ??:xs|w - aqs??b{ t? ?qx ?i9sqw)u ? ??:x s|w - aqs??b{ t? ???7 ??ax ?v?b{ t?)? 190 ?3216 ?? ?< z?)? 130 ?3225 ? { tx? ia x 20w p
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* ?b??wpx]_m?d?{ 9s? 300 200 100 0 9s? 300 200 100 0 9s? 400 300 200 100 0 ?? ?? ?? peak 260? max 10 sec max pb free soldering pb free soldering pb free soldering peak 260? max 10 sec max t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be reflow soldering for 2 times. t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be wave soldering for 1 time. t except for reflow soldering type. t?) t190? 3216type max , ?)? 130? 3225 type ming t it is recommended to use 20w soldering iron and the tip is 1 or less. t the soldering iron should not directly touch the components. t assured to be soldering iron for 1 time. note: the above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. temperature ? 300 200 100 0 t emperature ? 300 200 100 0 t emperature ? 400 300 200 100 0 preheating 150? 60 sec min gradually cooling gradually cooling gradually cooling heating above 230? 40 sec max preheating 150? 120 sec min 350? max 3 sec max 60 sec min ?) ?) e?? 260 ??< 10 | e?? 260 ??< 10 | '? 150? 60 ? 350 ??< 3 | 120 ? 60 ? '?150? ?c?230 ?? 40 | t?? qx?i9sqw)u 100 ? ??:xs|w - aqs??b{ t? ?qx ?i9sqw)u ? ??:x s|w - aqs??b{ t? ???7 ??ax ?v?b{ t?)? 190 ?3216 ?? ?< z?)? 130 ?3225 ? { tx? ia x 20w p
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* ?b??wpx]_m?d?{ 9s? 300 200 100 0 9s? 300 200 100 0 9s? 400 300 200 100 0 ?? ?? ?? peak 260? max 10 sec max pb free soldering pb free soldering pb free soldering peak 260? max 10 sec max t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be reflow soldering for 2 times. t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be wave soldering for 1 time. t except for reflow soldering type. t?) t190? 3216type max , ?)? 130? 3225 type ming t it is recommended to use 20w soldering iron and the tip is 1 or less. t the soldering iron should not directly touch the components. t assured to be soldering iron for 1 time. note: the above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. temperature ? 300 200 100 0 t emperatur e ? 300 200 100 0 t emperature ? 400 300 200 100 0 preheating 150? 60 sec min gradually cooling gradually cooling gradually cooling heating above 230? 40 sec max preheating 150? 120 sec min 350? max 3 sec max 60 sec min ?) ?) e?? 260 ??< 10 | e?? 260 ??< 10 | '? 150? 60 ? 350 ??< 3 | 120 ? 60 ? '?150? ?c?230 ?? 40 | t?? qx?i9sqw)u 100 ? ??:xs|w - aqs??b{ t? ?qx ?i9sqw)u ? ??:x s|w - aqs??b{ t? ???7 ??ax ?v?b{ t?)? 190 ?3216 ?? ?< z?)? 130 ?3225 ? { tx? ia x 20w p
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* ?b??wpx]_m?d?{ 9s? 300 200 100 0 9s? 300 200 100 0 9s? 400 300 200 100 0 ?? ?? ?? peak 260? max 10 sec max pb free soldering pb free soldering pb free soldering peak 260? max 10 sec max t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be reflow soldering for 2 times. t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be wave soldering for 1 time. t except for reflow soldering type. t?) t190? 3216type max , ?)? 130? 3225 type ming t it is recommended to use 20w soldering iron and the tip is 1 or less. t the soldering iron should not directly touch the components. t assured to be soldering iron for 1 time. note: the above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. temperature ? 300 200 100 0 t emperatur e ? 300 200 100 0 t emperature ? 400 300 200 100 0 preheating 150? 60 sec min gradually cooling gradually cooling gradually cooling heating above 230? 40 sec max preheating 150? 120 sec min 350? max 3 sec max 60 sec min ?) ?)
precautions ferrite products 5 259 technical considerations stages precautions 6 / 7 2 . cleaning conditions should be determined after verifying, through a test run, that the cleaning pro- cess do e s not affect the inductor's characteristics. 2 . inappropriate cleaning conditions insuf?cient or excessive cleaning may detrimentally affect the performance of the inductors. 1 excessive cleaning in the case of ultrasonic cleaning, too much power output can cause excessive vibration of the pc board which may lead to the cracking of the inductor or the soldered portion, or decrease the terminal electrodes' strength. thus the following conditions should be carefully checked; u ltra s onic output below 20 w/ y ultrasonic frequency below 40 khz ultrasonic washing period 5 min. or less 5 .cleaning 7 . handling breakaway pc boards splitting along perforations 1 . when splitting the pc board after mounting inductors and other components, care is required so as not to give any stresses of de?ection or twisting to the board. 2 . board separation should not be done manually, but by using the appropriate devices. general handling precautions 1 . always wear static control bands to protect against esd. 2 . keep the inductors away from all magnets and mag- n etic objects. 3 . use non-magnetic tweezers when handling inductors. 4 . any devices used with the inductors soldering irons, measuring instruments should be properly grounded. 5 . keep bare hands and metal products i.e., metal desk away from chip electrodes or conductive areas that lead to chip electrodes. 6 . keep inductors away from items that generate mag- n etic ?elds such as speakers or coils. mechanical considerations 1 . be careful not to subject the inductors to excessive mechanical shocks. 1 if inductors are dropped on the ?oor or a hard surface they should not be used. 2 when handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components. application of resin coatings, moldings, etc. to the pcb and components. 1 . with some type of resins a decomposition gas or chemical reaction vapor may remain inside the res- in duri ng the hardening period or while left under normal storage conditions resulting in the deterio- r ation o f the inductor's performance. 2 . when a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat may lead to inductor damage or destruction. 3 . stress caused by a resin ? s temperature generated expansion and contraction may damage inductors. the use of such resins, molding materials etc. is not recommended. 6 . post cleaning processes precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip beads
precautions ferrite products 5 261 7 / 7 8 . storage conditions 1 . if the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. for this reason, components should be used within 6 months from the time of delivery. if exceeding the above period, please check solder- a bilit y before using the inductors storage 1 . to maintain the solderability of terminal electrodes and to keep the packaging material in good condi- t ion, c are must be taken to control temperature and humidity in the storage area. humidity should especially be kept as low as possible. recommended conditions ambient temperature below 40 ? humidity below 70 % rh the ambient temperature must be kept below 30 ? . even under ideal storage conditions inductor electrode solderability decreases as time passes, so inductors should be used within 6 months from the time of delivery. *the packaging material should be kept where no chlorine or sulfur exists in the air. technical considerations stages precautions precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip beads

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